OCZ DDR3 PC3-16000 Flex II Edition

OCZ DDR3 PC3-16000 / 2000 MHz / Flex II XLC / 2GB Dual Channel

These premium modules run at incredibly fast 2000MHz speeds at CL8-8-8 timings for added performance to high-end systems with integrated water-cooling. Designed to the very core to offer enthusiasts the thermal management innovation of hybrid water and passive cooling, the new PC3-16000 Flex II Series offers rock-solid stability and performance for your high-end gaming or overclocking system.

The OCZ Flex II heat management solution enables high-frequency memory to operate within an optimal balance of extreme speeds and low latencies without the high temperatures that inhibit or damage the module. Each PC3-16000 Flex II memory module features this breakthrough thermal management technology from OCZ that combines an effective new heatspreader design with integrated liquid injection system and dedicated channels directly over the module's ICs to effectively dissipate heat produced by high-speed memory. This sophisticated series was engineered with a unique "flexible" design to give enthusiasts the option to run the modules passively or water cooled via the thick array of aluminum fins, and the concurrent use of both options promotes maximum heat dissipation.

The PC3-16000 Flex II modules are optimized for the latest cutting edge DDR3 platforms featuring the new NVIDIA ® 790i chipset and will be available in 2GB (2x1024MB) dual channel kits. In its continued effort to make overclocking a user-friendly pastime, OCZ includes all the necessary accessories right in the box to setup your unique water-cooling system immediately after purchase, without the inconvenience of searching for additional hardware.

* Qualified on XFX and EVGA 790i motherboards.

All Modules are tested in two module kits. Due to additional bus load, four module configurations may have to be run at lower frequency and relaxed latencies for stable operation. Test specifications are based on dual core CPUs only. If quad core CPUs are used, higher bus thresholds and core arbitration may necessitate lowering the memory frequency below tested specs.Test specifications are based on dual core CPUs only. If quad core CPUs are used, higher bus thresholds and core arbitration may necessitate lowering the memory frequency below tested specs.

**The new OCZ Flex II XLC (Xtreme Liquid Convention) heatsink delivers superior heat dissipation via the integrated pure aluminum heatsink and dedicated double liquid cooling channels directly over the module's ICs. The Flex II module was engineered with this unique "flexible" design to give enthusiasts the unparalleled option to run the modules passively or water cooled. The concurrent use of both technologies promotes maximum heat dissipation and pushes thermal management of memory modules one step further to keep up with the ever-increasing frequency demands. Flex II modules seamlessly co-migrate with any system upgrade to liquid cooling.

***OCZ EVP (Extended Voltage Protection) is a feature that allows performance enthusiasts to use a VDIMM of 1.95V without invalidating their OCZ Lifetime Warranty.

Credit : OCZ